EP3C40F484I7N()

The EP3C40F484I7N is a high-performance programmable logic device (PLD) from the Cyclone III family manufactured by Intel (formerly Altera). It is a versatile and cost-effective solution for a wide range of applications including industrial automation, telecommunications, automotive systems, and consumer electronics. This PLD features a powerful FPGA architecture with 40,000 LEs (logic elements) and 1,500 Kbits of embedded memory. It offers a variety of I/O options including up to 414 user I/O pins, LVDS (Low Voltage Differential Signaling), and High-Speed Serial I/Os. With its high logic density and abundant memory resources, this device can handle complex digital designs with ease. The EP3C40F484I7N supports a wide range of advanced features such as embedded Multipliers, PLLs (Phase-Locked Loops), and a JTAG debug interface for efficient design and test. It also offers low power consumption, making it an energy-efficient choice for applications that require power-saving features. Overall, the EP3C40F484I7N PLD provides a highly reliable and flexible solution for designers seeking to develop sophisticated systems that require high compute performance and low power consumption.

banner

Other Products

View More
  • AWSCR-4.00CP-T-ND

    AWSCR-4.00CP-T-ND

  • RO3156A-2-ND

    RO3156A-2-ND

  • CSTCE18M0V51-R0-ND

    CSTCE18M0V51-R0-ND

  • CSTCC3M50G56-R0-ND

    CSTCC3M50G56-R0-ND

  • CSTCR7M00G55B-R0-ND

    CSTCR7M00G55B-R0-ND

  • CSTCR6M25G53-R0-ND

    CSTCR6M25G53-R0-ND

  • CSTCR7M60G53-R0-ND

    CSTCR7M60G53-R0-ND

  • CSTLS25M0X53-B0-ND

    CSTLS25M0X53-B0-ND

  • 535-10007-2-ND,535-10007-1-ND,535-10007-6-ND

    535-10007-2-ND,535-10007-1-ND,535-10007-6-ND

  • CSTCC6M32G53A-R0-ND

    CSTCC6M32G53A-R0-ND

  • CSTLS8M19G56-A0-ND

    CSTLS8M19G56-A0-ND

  • CSTCE19M6V53C-R0-ND

    CSTCE19M6V53C-R0-ND

Related Blogs

  • 2026 / 08 / 27

    AWS Adds 2 Million Nvidia GPUs, Bringing Total Deployment to 3 Million

    AWS commits to 3M Nvidia GPUs by 2028, adding 2M Blackwell/Rubin chips to its March order. Also, AWS continues developing Trainium chips. ...

    AWS Adds 2 Million Nvidia GPUs, Bringing Total Deployment to 3 Million
  • 2026 / 08 / 26

    Apple Unveils M6 and M5 Ultra Chips

    Apple unveils M6 (2nm, 12-core) and M5 Ultra (quad-die, 36/80 cores), cementing on-device AI as core strategy....

    Apple Unveils M6 and M5 Ultra Chips
  • 2026 / 08 / 25

    Korean Chipmakers Expand NAND Output in China

    AI demand drives Samsung and SK Hynix to expand NAND output in China. Samsung upgrades Xi'an for V9 chips, SK Hynix restarts Dalian's second fab....

    Korean Chipmakers Expand NAND Output in China
  • 2026 / 08 / 24

    Taiwan's Top Five OSAT Giants Invest Over NT$460 Billion in Capacity Expansion

    Explore high voltage capacitors, including types, key parameters, applications, and selection guidelines. Learn about MLCC, ceramic, and film capacitor solutions....

    Taiwan's Top Five OSAT Giants Invest Over NT$460 Billion in Capacity Expansion
  • 2026 / 08 / 21

    High Voltage Capacitors: Types, Key Parameters, and Selection Guide

    Explore high voltage capacitors, including types, key parameters, applications, and selection guidelines. Learn about MLCC, ceramic, and film capacitor solutions....

    High Voltage Capacitors: Types, Key Parameters, and Selection Guide
  • 2026 / 08 / 20

    Marvell and Google Forge Strategic Partnership in Custom Product

    Google diversifies its AI chip strategy via a custom semiconductor partnership with Marvell, spanning inference accelerators and networking silicon ...

    Marvell and Google Forge Strategic Partnership in Custom Product
  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
Contact Information
close