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TI's TPSM series power modules employ a highly integrated synchronous buck architecture that combines controllers, power MOSFETs, inductors, and passive components into a single package. This significantly streamlines power supply design and reduces PCB footprint. The TPSM family covers a comple...
Friday 07 August, 2026
VIEW MOREOn August 4, supply chain sources revealed that Samsung Electronics, SK Hynix, and Micron have completed negotiations for the full-year 2027 DRAM and HBM capacity allocation, with all capacity fully sold out. The allocation targets two customer categories. First, CSPs and major AI chip clients that ...
Thursday 06 August, 2026
VIEW MOREOn August 4, 2026, SK Hynix and SanDisk jointly released the first industry standard specification for the next-generation storage technology - High Bandwidth Flash (HBF). This specification was officially made public by the world's largest open data center technology cooperation organization, O...
Wednesday 05 August, 2026
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