EPM7128AETC100-10

Introducing the EPM7128AETC100-10, a versatile and high-performance programmable logic device. This device is part of the EPM family from Altera, a leading provider of programmable logic solutions. With its powerful features and advanced capabilities, the EPM7128AETC100-10 is the perfect solution for a wide range of applications in various industries. Featuring 128 macrocells, this programmable logic device offers a large capacity for implementing complex logic designs. The EPM7128AETC100-10 operates at a speed grade of -10, ensuring fast and efficient performance in demanding applications. With its high-density architecture and flexible design, this device allows designers to implement multiple functions on a single chip, reducing the overall system cost and complexity. The EPM7128AETC100-10 also features an advanced programming technology that allows for easy design updates and modifications, making it an ideal choice for prototyping and development. Furthermore, this programmable logic device is designed to meet stringent industry standards for reliability and performance. It operates at a low power consumption, making it suitable for battery-powered applications. In conclusion, the EPM7128AETC100-10 is a versatile and high-performance programmable logic device, offering designers the flexibility and performance they need for a wide range of applications.

banner

Other Products

View More
  • RT0603CRC07147KL-ND

    RT0603CRC07147KL-ND

  • 766143473GPTR13-ND

    766143473GPTR13-ND

  • 2019-RN73H1JTTD3833C50TR-ND,2019-RN73H1JTTD3833C50CT-ND,2019-RN73H1JTTD3833C50DKR-ND

    2019-RN73H1JTTD3833C50TR-ND,2019-RN73H1JTTD3833C50CT-ND,2019-RN73H1JTTD3833C50DKR-ND

  • RL20S472GB14-ND

    RL20S472GB14-ND

  • RNCF2010DKE11R5-ND

    RNCF2010DKE11R5-ND

  • 541-RLR07C4124FRRE5TR-ND

    541-RLR07C4124FRRE5TR-ND

  • A137528-ND

    A137528-ND

  • RM32B1.0K/2.0KPTR-ND,RM32B1.0K/2.0KPCT-ND,RM32B1.0K/2.0KPDKR-ND

    RM32B1.0K/2.0KPTR-ND,RM32B1.0K/2.0KPCT-ND,RM32B1.0K/2.0KPDKR-ND

  • 766-161-R68P-ND

    766-161-R68P-ND

  • 2019-RN731JTTD1692F10TR-ND

    2019-RN731JTTD1692F10TR-ND

  • 2019-RN73R2ATTD2083C25TR-ND,2019-RN73R2ATTD2083C25CT-ND,2019-RN73R2ATTD2083C25DKR-ND

    2019-RN73R2ATTD2083C25TR-ND,2019-RN73R2ATTD2083C25CT-ND,2019-RN73R2ATTD2083C25DKR-ND

  • 541-RNC55J20R8BSRE5TR-ND

    541-RNC55J20R8BSRE5TR-ND

Related Blogs

  • 2026 / 07 / 30

    UMC Bets $4.6B on Silicon Photonics, Dual-Track Expansion Plan

    UMC commits $4.6B to silicon photonics expansion, fast-tracking Singapore P4 fab for immediate capacity while breaking ground on Tainan P7/P8....

    UMC Bets $4.6B on Silicon Photonics, Dual-Track Expansion Plan
  • 2026 / 07 / 29

    MLCC Price Increase: Samsung Electro-Mechanics and Taiyo Follow in Raising Prices

    MLCC prices surge again: Samsung hikes 30%, Taiyo Yuden raises prices amid severe shortages. AI servers use 8-10x more MLCC, pushing lead times beyond 20 weeks. ...

    MLCC Price Increase: Samsung Electro-Mechanics and Taiyo Follow in Raising Prices
  • 2026 / 07 / 28

    Microchip Acquires Israeli Edge AI Chip Company Hailo

    Microchip buys Hailo to expand edge AI processing, integrating accelerators and vision SoCs. The acquisition closes in September 2026....

    Microchip Acquires Israeli Edge AI Chip Company Hailo
  • 2026 / 07 / 27

    Qualcomm Chip Prices, Up Double-Digit Percentage

    Qualcomm announces double-digit chip price hikes from September 1 as AI-driven supply shortages and surging DRAM costs bite. ...

    Qualcomm Chip Prices, Up Double-Digit Percentage
  • 2026 / 07 / 24

    NVIDIA Invests $1.5 Billion in Amkor for Advanced Packaging Capacity Expansion

    NVIDIA's $1.5B prepayment to Amkor expands U.S. advanced packaging capacity in Arizona, securing AI chip supply, reducing Asian dependence, and complementing TSMC's fab....

    NVIDIA Invests $1.5 Billion in Amkor for Advanced Packaging Capacity Expansion
  • 2026 / 07 / 23

    AMD and Anthropic Reach Multimillion‑Dollar AI Server Procurement Agreement

    AMD and Anthropic sign AI server pact: 2GW MI450 GPUs in Helios racks, $5B AMD equity investment, first 1GW deployment starting H1 2027....

    AMD and Anthropic Reach Multimillion‑Dollar AI Server Procurement Agreement
  • 2026 / 07 / 22

    ABB Acquires Advantics to Strengthen Silicon Carbide Power Conversion Portfolio

    ABB has acquired Advantics, a French SiC power conversion specialist. The deal strengthens ABB's DC portfolio for data centers, microgrids, and EV infrastructure....

    ABB Acquires Advantics to Strengthen Silicon Carbide Power Conversion Portfolio
  • 2026 / 07 / 21

    TI Popular Components Selection Guide: High-Demand Part Details

    TI's recent popular ICs: precision op amps, battery management, power LDOs, logic/interface, and current‑sense/isolation....

    TI Popular Components Selection Guide: High-Demand Part Details
  • 2026 / 07 / 20

    UMC's Dual-Track Advanced Packaging Strategy: Silicon Interposer and TGV Tech

    UMC's dual bet: silicon interposer and TGV glass substrate integration. A differentiated wafer‑level play to ease CoWoS bottlenecks, with high‑volume ramp targeted for 2027‑28....

    UMC's Dual-Track Advanced Packaging Strategy: Silicon Interposer and TGV Tech
  • 2026 / 07 / 17

    Intel First to Achieve High-NA EUV Mass Production for Logic Chips

    Intel first to mass-produce High‑NA EUV logic chips on 18A. Panther Lake with 50%+ performance gains and 180 TOPS. ...

    Intel First to Achieve High-NA EUV Mass Production for Logic Chips
Contact Information
close