Introduction

In today's rapidly evolving digital age, data centers have become the backbone of cloud computing, artificial intelligence, and big data analytics, playing a critical role in supporting key technologies. To meet the growing demand for performance, Samsung Electro-Mechanics (SEM) and AMD have announced a significant collaboration where Samsung will supply AMD with high-performance FCBGA (Flip Chip Ball Grid Array) substrates for hyperscale data centers. This partnership not only showcases Samsung's technological prowess in high-performance substrates but also highlights AMD's continuous innovation and leadership in data center and compute-intensive applications.

Samsung Electro-Mechanics' Investment and Technological Edge

Samsung Electro-Mechanics has invested a staggering 19 trillion won (approximately 99.5 billion yuan) in the FCBGA substrate field. This substantial investment not only demonstrates Samsung's commitment to the high-performance substrate market but also solidifies its leading position in this domain. Samsung has collaborated with AMD to develop packaging technology that integrates multiple semiconductor chips onto a single substrate, which is crucial for CPU and GPU applications and enables the high-density interconnectivity required by hyperscale data centers.

Technical Features of High-Performance Substrates

Compared to conventional computer substrates, data center substrates have ten times the area and three times the layer count. This high-density packaging technology not only enhances the performance and efficiency of data centers but also raises the bar for chip power supply and reliability. Samsung Electro-Mechanics has addressed the warping issues of large-area substrates through innovative manufacturing processes, ensuring high yield rates during chip installation. This is crucial for the mass production and application of data center substrates.

Significance of Strategic Cooperation

Kim Won-taek, Vice President and Head of Strategic Marketing at Samsung Electro-Mechanics, stated, "We have become a strategic partner of AMD, a global leader in HPC (High-Performance Computing) and AI (Artificial Intelligence) semiconductor solutions. We will continue to invest in advanced substrate solutions to meet the ever-changing needs of data centers and compute-intensive applications, providing core value to customers like AMD." This strategic cooperation not only strengthens the collaboration between Samsung and AMD in the field of high-performance substrates but also lays a solid foundation for their future development in data centers and compute-intensive applications.

AMD's Response and Future Outlook

Scott Aylor, Vice President of Global Operations Manufacturing Strategy at AMD, said, "AMD has always been at the forefront of innovation to meet customer demands for performance and efficiency. Our leadership in chip technology allows us to provide exceptional performance, efficiency, and flexibility in our CPU and data center GPU product portfolios. Our ongoing investment with partners like Samsung Electronics ensures that we have the advanced substrate technology and capabilities needed for future HPC and AI products." This response not only showcases AMD's technological strength in high-performance computing and artificial intelligence but also demonstrates its firm belief in the future development of data center technology.

Conclusion

The collaboration between Samsung Electro-Mechanics and AMD in the field of FCBGA substrates is not only a significant strategic alliance between the two companies but also a major push for the entire data center industry. With the development of emerging technologies such as artificial intelligence, 5G, and big data, the demand for high-performance substrates will continue to grow. The cooperation between Samsung Electro-Mechanics and AMD will provide strong technical support for the future development of data centers, driving technological progress and innovation across the industry.

Through this collaboration, Samsung Electro-Mechanics and AMD not only showcase their technological capabilities in high-performance substrates but also provide a solid technological foundation for the future development of data centers. As technology continues to advance and market demand grows, this partnership will play an increasingly important role in the future.

IC Electronic Components

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