At the Hot Chips Conference 2024, the world's leading chip manufacturers showcased their latest technologies and products. This article delves into some of the most compelling chip technologies unveiled by Intel, AMD, IBM, NVIDIA, Qualcomm, and Tesla during the conference.

NVIDIA: Comprehensive Showcase of Blackwell Architecture

NVIDIA unveiled detailed information about its next-generation GPU architecture, Blackwell. Blackwell is a comprehensive computing solution encompassing various chipsets such as Blackwell GPU, Grace CPU, and BlueField data processing units. A highlight of this architecture is its high-bandwidth interconnect capability, enabling two GPU chips to achieve 10TB/s of bandwidth through NV-HBI technology. Additionally, NVIDIA introduced new FP4 and FP6 precisions along with the GB200 NVL72 chip designed for trillion-parameter AI.

IBM: Telum II Processor and Spyre Accelerator

IBM announced previews of its next-generation AI accelerator, the Telum II processor, and the Spyre Accelerator at the conference. The Telum II processor, utilizing Samsung's 5nm technology, offers enhanced performance and larger cache capacity. Meanwhile, the Spyre Accelerator comprises 32 AI accelerator cores, sharing an architecture with the AI accelerators in the Telum II chip, aiming to support a broader range of AI models.

Intel: Xeon 6 SoC and Lunar Lake Processors

Intel presented its Xeon 6 SoC and Lunar Lake client processors. The Xeon 6 SoC integrates high-performance computing chipsets with edge-optimized I/O chipsets, offering advanced features like PCIe 5.0, CXL 2.0, and 100G Ethernet. The Lunar Lake processors, on the other hand, feature improvements in both performance cores and efficient cores, delivering increased performance and reduced power consumption.

AMD: Zen 5 Core Architecture

AMD provided an in-depth look at its Zen 5 core architecture, marking the next iteration in its high-performance PC journey. Zen 5 boasts a 16% IPC uplift through AVX-512 and FP-512 variants, and adopts 4nm/3nm process technology. AMD also plans to add additional ISA extensions and security features through Zen 5 and Zen 5C core variants.

Qualcomm: Oryon Core CPU

Qualcomm showcased its Oryon CPU within the Snapdragon X Elite. Oryon, Qualcomm's Arm-based core, focuses on critical areas such as instruction fetching, vector execution, renaming and retirement, integer execution, memory management, and load/store. The design of Oryon emphasizes a balance between high performance and low power consumption.

Tesla: TTPoE Protocol

Tesla introduced its TTPoE (Tesla Transport Protocol over Ethernet), a low-latency network protocol designed for the Dojo supercomputer. By simplifying the TCP protocol's state machine and optimizing connection opening and closing sequences, TTPoE offers better latency performance than standard TCP protocols.

China's Xiangshan RISC-V Processor

The Institute of Computing Technology, Chinese Academy of Sciences, exhibited the latest advancements in its open-source, high-performance RISC-V processor core, "Xiangshan." The third-generation Xiangshan (with Kunming Lake as its microarchitecture codename) targets the performance standards of Arm Neoverse N2, showcasing China's progress in high-performance processor design.

In conclusion, the Hot Chips 2024 Conference showcased the chip industry's latest advancements in AI, high-performance computing, and networking technologies, portending the future direction of computing technology development.

Conevo Electronic Supplier

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