Intel EP1C3T144C8

EP1C3T144C8


  • Manufacturer: Intel
  • CONEVO NO: EP1C3T144C8
  • Package: 144-LQFP
  • Datasheet: PDF
  • Stock: In stock
  • Description: EP1C3T144C8(Kg)

Details

Tags

Parameters
Series Cyclone®
Moisture Sensitivity Level (MSL) 3 (168 Hours)
RoHS Status RoHS non-compliant
Package / Case 144-LQFP
Mfr Intel
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Supplier Device Package 144-TQFP (20x20)
Number of I/O 104
Voltage - Supply 1.425V ~ 1.575V
Number of Logic Elements/Cells 2910
Number of LABs/CLBs 291
Total RAM Bits 59904
Package Tray
Product Status Obsolete
Conevo-Key Programmable Not Verified
Base Product Number EP1C3
Standard Package 60
ECCN 3A991D
HTSUS 8542.39.0001

The Intel EP1C3T144C8 is a Cyclone FPGA IC from Intel, which is known for its cost-effective solution in the field of programmable logic devices. This FPGA is characterized by 2910 logic elements and operates at a maximum frequency of 275.03 MHz. It is housed in a 144-pin TQFP (Thin Quad Flat Package) package and operates with a supply voltage ranging from 1.425V to 1.575V.

EP1C3T144C8 Features

The EP1C3T144C8 FPGA boasts a variety of features that make it suitable for a range of applications. It includes up to 58.5 Kbit of embedded memory, which is equivalent to 59904 bits, and offers 104 input/output ports. This device supports various I/O standards including LVTTL, LVCMOS, SSTL-2, and SSTL-3, making it versatile for different interfacing needs. It also supports high-speed LVDS I/O at 640Mbps and low-speed LVDS I/O at 311Mbps, which enhances its capability to handle high-data-rate applications.

EP1C3T144C8 Applications

The EP1C3T144C8 FPGA finds its application in a multitude of fields due to its performance and flexibility. It is commonly used in communication systems, industrial automation, medical devices, and military systems where high reliability and adaptability are required. Its low power consumption and high-density logic make it an ideal choice for embedded systems and other applications where space and power efficiency are critical.

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