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2026 / 07 / 31
Holtek Increase Product Prices 10% - 20%
Holtek Semiconductor announces a sweeping 10%-20% price hike across its MCU portfolio, driven by relentless cost pressures from packaging and foundry partners....
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2026 / 07 / 30
UMC Bets $4.6B on Silicon Photonics, Dual-Track Expansion Plan
UMC commits $4.6B to silicon photonics expansion, fast-tracking Singapore P4 fab for immediate capacity while breaking ground on Tainan P7/P8....
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2026 / 07 / 29
MLCC Price Increase: Samsung Electro-Mechanics and Taiyo Follow in Raising Prices
MLCC prices surge again: Samsung hikes 30%, Taiyo Yuden raises prices amid severe shortages. AI servers use 8-10x more MLCC, pushing lead times beyond 20 weeks. ...
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2026 / 07 / 28
Microchip Acquires Israeli Edge AI Chip Company Hailo
Microchip buys Hailo to expand edge AI processing, integrating accelerators and vision SoCs. The acquisition closes in September 2026....
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2026 / 07 / 27
Qualcomm Chip Prices, Up Double-Digit Percentage
Qualcomm announces double-digit chip price hikes from September 1 as AI-driven supply shortages and surging DRAM costs bite. ...
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2026 / 07 / 24
NVIDIA Invests $1.5 Billion in Amkor for Advanced Packaging Capacity Expansion
NVIDIA's $1.5B prepayment to Amkor expands U.S. advanced packaging capacity in Arizona, securing AI chip supply, reducing Asian dependence, and complementing TSMC's fab....
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2026 / 07 / 23
AMD and Anthropic Reach Multimillion‑Dollar AI Server Procurement Agreement
AMD and Anthropic sign AI server pact: 2GW MI450 GPUs in Helios racks, $5B AMD equity investment, first 1GW deployment starting H1 2027....
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2026 / 07 / 22
ABB Acquires Advantics to Strengthen Silicon Carbide Power Conversion Portfolio
ABB has acquired Advantics, a French SiC power conversion specialist. The deal strengthens ABB's DC portfolio for data centers, microgrids, and EV infrastructure....
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2026 / 07 / 21
TI Popular Components Selection Guide: High-Demand Part Details
TI's recent popular ICs: precision op amps, battery management, power LDOs, logic/interface, and current‑sense/isolation....
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2026 / 07 / 20
UMC's Dual-Track Advanced Packaging Strategy: Silicon Interposer and TGV Tech
UMC's dual bet: silicon interposer and TGV glass substrate integration. A differentiated wafer‑level play to ease CoWoS bottlenecks, with high‑volume ramp targeted for 2027‑28....