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2026 / 07 / 24
NVIDIA Invests $1.5 Billion in Amkor for Advanced Packaging Capacity Expansion
NVIDIA's $1.5B prepayment to Amkor expands U.S. advanced packaging capacity in Arizona, securing AI chip supply, reducing Asian dependence, and complementing TSMC's fab....
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2026 / 07 / 23
AMD and Anthropic Reach Multimillion‑Dollar AI Server Procurement Agreement
AMD and Anthropic sign AI server pact: 2GW MI450 GPUs in Helios racks, $5B AMD equity investment, first 1GW deployment starting H1 2027....
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2026 / 07 / 22
ABB Acquires Advantics to Strengthen Silicon Carbide Power Conversion Portfolio
ABB has acquired Advantics, a French SiC power conversion specialist. The deal strengthens ABB's DC portfolio for data centers, microgrids, and EV infrastructure....
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2026 / 07 / 21
TI Popular Components Selection Guide: High-Demand Part Details
TI's recent popular ICs: precision op amps, battery management, power LDOs, logic/interface, and current‑sense/isolation....
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2026 / 07 / 20
UMC's Dual-Track Advanced Packaging Strategy: Silicon Interposer and TGV Tech
UMC's dual bet: silicon interposer and TGV glass substrate integration. A differentiated wafer‑level play to ease CoWoS bottlenecks, with high‑volume ramp targeted for 2027‑28....
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2026 / 07 / 17
Intel First to Achieve High-NA EUV Mass Production for Logic Chips
Intel first to mass-produce High‑NA EUV logic chips on 18A. Panther Lake with 50%+ performance gains and 180 TOPS. ...
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2026 / 07 / 16
Samsung's Foundry Business Achieves First Monthly Profit in Three Years
Samsung's foundry had first monthly profit in June 2026 via HBM base dies and 4nm yield about 80%....
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2026 / 07 / 15
Tower Semiconductor to Invest $3B in Japan Semiconductor Expansion
Tower Semiconductor is investing $3 billion, with $1 billion in Japanese government grants, to expand its Japan-based 300mm silicon photonics and SiGe manufacturing capacity....
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2026 / 07 / 14
Accelerometer: A Complete Guide to Principle and Selection
An accelerometer is an electromechanical sensor that measures proper acceleration using an inertial proof mass. MEMS-based capacitive accelerometers dominate consumer and industrial markets....
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2026 / 07 / 13
Apple and Broadcom Sign Over $30 Billion Chip Deal
Apple inks a $30B+ multi-year chip deal with Broadcom, expanding Fort Collins factory to produce 15B U.S.-made chips through 2031....