AMD XAZU7EV-1FBVB900Q

XAZU7EV-1FBVB900Q


  • Manufacturer: AMD
  • CONEVO NO: XAZU7EV-1FBVB900Q
  • Package: 900-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: In stock
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Parameters
Mfr AMD
Series Zynq® UltraScale+™ MPSoC EV
Package Tray
Product Status Active
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 600MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Operating Temperature -40°C ~ 125°C (TJ)
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
Number of I/O 220
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Other Names 122-XAZU7EV-1FBVB900Q
Standard Package 1
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EV Zynq®UltraScale+™ FPGA, 192K+ Logic Cells 500MHz, 600MHz, 1.2GHz 900-FCBGA (31x31)
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