AMD XC7K70T-2FBG676C

XC7K70T-2FBG676C


  • Manufacturer: AMD
  • CONEVO NO: XC7K70T-2FBG676C
  • Package: 676-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: XC7K70T-2FBG676C(Kg)

Details

Tags

Parameters
Series Kintex®-7
Moisture Sensitivity Level (MSL) 4 (72 Hours)
RoHS Status ROHS3 Compliant
Package / Case 676-BBGA, FCBGA
Mfr AMD
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Supplier Device Package 676-FCBGA (27x27)
Number of I/O 300
Voltage - Supply 0.97V ~ 1.03V
Number of Logic Elements/Cells 65600
Number of LABs/CLBs 5125
Total RAM Bits 4976640
Package Tray
Product Status Active
Conevo-Key Programmable Not Verified
Base Product Number XC7K70
REACH Status REACH Unaffected
Standard Package 40
ECCN 3A991D
HTSUS 8542.39.0001

The AMD XC7K70T-2FBG676C is a high-performance Field Programmable Gate Array (FPGA) belonging to the Kintex-7 family, designed and manufactured by AMD. This particular model is characterized by its exceptional price-performance ratio and low power consumption, making it an ideal choice for a wide range of applications, especially those in the realm of fast-growing industries and wireless communications. The chip is housed in a 676-ball FBGA package, providing numerous input/output pins for versatile connectivity.

Key Features

The XC7K70T-2FBG676C offers a compelling blend of features, including:

  • High-Speed Transceivers: Equipped with high-speed transceivers capable of operating at data rates up to 12.5 Gb/s, enabling applications such as 3G and 4G wireless communications and high-speed data interfaces.

  • Abundant Logic Resources: The FPGA provides a vast array of logic cells, memory blocks, and digital signal processing (DSP) slices, allowing for the implementation of complex digital systems.

  • Low Power Consumption: The 28nm process technology employed in its manufacturing contributes to its energy efficiency, making it suitable for power-constrained applications.

  • Robust Performance: The chip delivers exceptional performance in terms of speed, capacity, and reliability, making it well-suited for demanding applications.

  • Flexible Configuration: The FPGA's programmable nature enables it to be customized to meet the specific requirements of various applications.

Applications

The versatility and performance of the XC7K70T-2FBG676C make it a suitable choice for a wide range of applications, including:

· Wireless Communications: Its high-speed transceivers and low power consumption make it ideal for base stations, wireless routers, and other wireless communication equipment.

· Video Processing: The chip's DSP slices and high-speed interfaces make it suitable for video encoding, decoding, and processing applications.

· Industrial Automation: Its flexibility and robustness make it ideal for industrial control systems, motor drives, and programmable logic controllers (PLCs).

· Networking: The XC7K70T-2FBG676C can be used to implement network switches, routers, and other networking equipment.

· Aerospace and Defense: Its reliability and radiation tolerance make it suitable for aerospace and defense applications, such as radar systems and satellite communication.

The AMD XC7K70T-2FBG676C is a powerful and versatile FPGA that offers a compelling combination of performance, flexibility, and power efficiency. Its wide range of applications makes it a valuable asset for engineers and designers working on cutting-edge electronic systems.


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