AMD XC7Z007S-1CLG225C

XC7Z007S-1CLG225C


  • Manufacturer: AMD
  • CONEVO NO: XC7Z007S-1CLG225C
  • Package: 225-LFBGA, CSPBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: XC7Z007S-1CLG225C(Kg)

Details

Tags

Parameters
Mfr AMD
Series Zynq®-7000
Package Tray
Product Status Active
Architecture MCU, FPGA
Core Processor Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 667MHz
Primary Attributes Artix™-7 FPGA, 23K Logic Cells
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 225-LFBGA, CSPBGA
Supplier Device Package 225-CSPBGA (13x13)
Number of I/O 54
Base Product Number XC7Z007
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Other Names 122-2002
Standard Package 160
Single ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Artix™-7 FPGA, 23K Logic Cells 667MHz 225-CSPBGA (13x13)
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