AMD XCKU3P-2FFVD900E

XCKU3P-2FFVD900E


  • Manufacturer: AMD
  • CONEVO NO: XCKU3P-2FFVD900E
  • Package: 900-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: In stock
If you need to check our product or price list, please leave your email and we will contact you within 24 hours. Clicking on the website skype will result in a faster response!

Details

Tags

Parameters
Mfr AMD
Series Kintex® UltraScale+™
Package Tray
Product Status Active
Conevo-Key Programmable Not Verified
Number of LABs/CLBs 20340
Number of Logic Elements/Cells 355950
Total RAM Bits 31641600
Number of I/O 304
Voltage - Supply 0.825V ~ 0.876V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 100°C (TJ)
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
Base Product Number XCKU3
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 4 (72 Hours)
ECCN 3A991D
HTSUS 8542.39.0001
Standard Package 1
Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC 304 31641600 355950 900-BBGA, FCBGA
Contact Information
close