AMD XCVC1502-2MLENSVG1369

XCVC1502-2MLENSVG1369


  • Manufacturer: AMD
  • CONEVO NO: XCVC1502-2MLENSVG1369
  • Package: 1369-BFBGA, FCBGA
  • Datasheet: -
  • Stock: In stock
  • Description: XCVC1502-2MLENSVG1369(Kg)

Details

Tags

Parameters
Mfr AMD
Series Versal™ AI Core
Package Tray
Product Status Active
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 600MHz, 1.4GHz
Primary Attributes Versal™ AI Core FPGA, 800k Logic Cells
Operating Temperature 0°C ~ 110°C (TJ)
Package / Case 1369-BFBGA, FCBGA
Supplier Device Package 1369-FCBGA (35x35)
Number of I/O 478
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Other Names 122-XCVC1502-2MLENSVG1369
Standard Package 1
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ System On Chip (SOC) IC Versal™ AI Core Versal™ AI Core FPGA, 800k Logic Cells 600MHz, 1.4GHz 1369-FCBGA (35x35)
Contact Information
close