AMD XCVC1702-1LSENSVG1369

XCVC1702-1LSENSVG1369


  • Manufacturer: AMD
  • CONEVO NO: XCVC1702-1LSENSVG1369
  • Package: 1369-BFBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: XCVC1702-1LSENSVG1369(Kg)

Details

Tags

Parameters
Mfr AMD
Series Versal™ AI Core
Package Tray
Product Status Active
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size -
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 400MHz, 1GHz
Primary Attributes Versal™ AI Core FPGA, 1M Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Package / Case 1369-BFBGA
Supplier Device Package 1369-BGA (35x35)
Number of I/O 500
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 4 (72 Hours)
ECCN 3A001A7B
HTSUS 8542.39.0001
Other Names 122-XCVC1702-1LSENSVG1369
Standard Package 1
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ System On Chip (SOC) IC Versal™ AI Core Versal™ AI Core FPGA, 1M Logic Cells 400MHz, 1GHz 1369-BGA (35x35)
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