AMD XCVC1902-1MSIVSVD1760

XCVC1902-1MSIVSVD1760


  • Manufacturer: AMD
  • CONEVO NO: XCVC1902-1MSIVSVD1760
  • Package: 1760-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: XCVC1902-1MSIVSVD1760(Kg)

Details

Tags

Parameters
Mfr AMD
Series Versal™ AI Core
Package Tray
Product Status Active
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 600MHz, 1.3GHz
Primary Attributes Versal™ AI Core FPGA, 1.9M Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1760-BFBGA, FCBGA
Supplier Device Package 1760-FCBGA (40x40)
Number of I/O 692
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 4 (72 Hours)
ECCN 3A001A7B
HTSUS 8542.39.0001
Other Names 122-XCVC1902-1MSIVSVD1760
Standard Package 1
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ System On Chip (SOC) IC Versal™ AI Core Versal™ AI Core FPGA, 1.9M Logic Cells 600MHz, 1.3GHz 1760-FCBGA (40x40)
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