AMD XCVE1752-1MSINSVG1369

XCVE1752-1MSINSVG1369


  • Manufacturer: AMD
  • CONEVO NO: XCVE1752-1MSINSVG1369
  • Package: 1369-BFBGA, FCBGA
  • Datasheet: -
  • Stock: In stock
If you have any question, please feel free to contact with us.We will reply you within 24 hours.

Details

Tags

Parameters
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 600MHz, 1.3GHz
Package / Case 1369-BFBGA, FCBGA
Supplier Device Package 1369-FCBGA (35x35)
Number of I/O 500
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Other Names 122-XCVE1752-1MSINSVG1369
Standard Package 1
Mfr AMD
Series Versal™ AI Core
Package Tray
Product Status Active
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ System On Chip (SOC) IC Versal™ AI Core 600MHz, 1.3GHz 1369-FCBGA (35x35)
Contact Information
close