AMD XCVM1302-1LLINBVB1024

XCVM1302-1LLINBVB1024


  • Manufacturer: AMD
  • CONEVO NO: XCVM1302-1LLINBVB1024
  • Package: 1024-BFBGA
  • Datasheet: PDF
  • Stock: In stock
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Details

Tags

Parameters
Mfr AMD
Series Versal™ Prime
Package Tray
Product Status Active
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size -
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 400MHz, 1GHz
Primary Attributes Versal™ Prime FPGA, 70k Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1024-BFBGA
Supplier Device Package 1024-BGA (31x31)
Number of I/O 316
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Other Names 122-XCVM1302-1LLINBVB1024
Standard Package 1
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ System On Chip (SOC) IC Versal™ Prime Versal™ Prime FPGA, 70k Logic Cells 400MHz, 1GHz 1024-BGA (31x31)
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