AMD XCVU23P-2FSVJ1760I

XCVU23P-2FSVJ1760I


  • Manufacturer: AMD
  • CONEVO NO: XCVU23P-2FSVJ1760I
  • Package: 1760-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: In stock
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Details

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Parameters
Mfr AMD
Series Virtex® UltraScale+™
Package Tray
Product Status Active
Conevo-Key Programmable Not Verified
Number of LABs/CLBs 128700
Number of Logic Elements/Cells 2252250
Total RAM Bits 77909197
Number of I/O 644
Voltage - Supply 0.825V ~ 0.876V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1760-BBGA, FCBGA
Supplier Device Package 1760-FCBGA (42.5x42.5)
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 4 (72 Hours)
ECCN 3A001A7B
HTSUS 8542.39.0001
Other Names 122-XCVU23P-2FSVJ1760I
Standard Package 1
Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC 644 77909197 2252250 1760-BBGA, FCBGA
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