Parameters |
Package |
Tray |
Product Status |
Active |
Architecture |
MCU, FPGA |
Core Processor |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size |
- |
RAM Size |
256KB |
Peripherals |
DMA, WDT |
Connectivity |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed |
533MHz, 600MHz, 1.3GHz |
Primary Attributes |
Zynq®UltraScale+™ FPGA, 599K+ Logic Cells |
Operating Temperature |
0°C ~ 100°C (TJ) |
Package / Case |
1156-BBGA, FCBGA |
Supplier Device Package |
1156-FCBGA (35x35) |
Number of I/O |
328 |
Base Product Number |
XCZU9 |
RoHS Status |
ROHS3 Compliant |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
REACH Status |
REACH Unaffected |
ECCN |
5A002A4 XIL |
HTSUS |
8542.31.0001 |
Standard Package |
1 |
Mfr |
AMD |
Series |
Zynq® UltraScale+™ MPSoC EG |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 599K+ Logic Cells 533MHz, 600MHz, 1.3GHz 1156-FCBGA (35x35)