Epson Electronics America Inc-Semiconductor Div S1C31D01F101000 -119

S1C31D01F101000 -119


  • Manufacturer: Epson Electronics America Inc-Semiconductor Div
  • CONEVO NO: S1C31D01F101000 -119
  • Package: 80-TQFP
  • Datasheet: PDF
  • Stock: In stock
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Mfr Epson Electronics America Inc-Semiconductor Div
Series -
Package Tray
Product Status Active
Core Processor ARM® Cortex®-M0+
Core Size 32-Bit
Speed 21MHz
Connectivity I²C, IrDA, QSPI, SPI, UART/USART, USB
Peripherals Brown-out Detect/Reset, DMA, POR, PWM, Temp Sensor, Voltage Detect, WDT
Number of I/O 57
Program Memory Size 256KB (256K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 96K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 5.5V
Data Converters A/D 8x12b SAR
Oscillator Type External, Internal
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Package / Case 80-TQFP
Supplier Device Package 80-TQFP14 (12x12)
Other Names 502-S1C31D01F101000-119
Standard Package 119
ARM® Cortex®-M0+ - Microcontroller IC 32-Bit 21MHz 256KB (256K x 8) FLASH 80-TQFP14 (12x12)
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