Epson Electronics America Inc-Semiconductor Div S1C6F016F401100

S1C6F016F401100


  • Manufacturer: Epson Electronics America Inc-Semiconductor Div
  • CONEVO NO: S1C6F016F401100
  • Package: 100-BFQFP
  • Datasheet: -
  • Stock: In stock
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Parameters
Mfr Epson Electronics America Inc-Semiconductor Div
Series -
Package Tray
Product Status Not For New Designs
Core Processor S1C63000
Core Size 4-Bit
Speed 4MHz
Connectivity SPI
Peripherals LCD, PWM, RFC, WDT
Number of I/O 24
Program Memory Size 26KB (16K x 13)
Program Memory Type FLASH
EEPROM Size -
RAM Size 2K x 4
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V
Data Converters -
Oscillator Type External
Operating Temperature -20°C ~ 70°C (TA)
Mounting Type Surface Mount
Package / Case 100-BFQFP
Supplier Device Package 100-QFP15 (14x14)
Base Product Number S1C6F016
RoHS Status RoHS Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN EAR99
HTSUS 8542.31.0001
Standard Package 90
S1C63000 - Microcontroller IC 4-Bit 4MHz 26KB (16K x 13) FLASH 100-QFP15 (14x14)
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