Infineon Technologies CY62157G30-45ZSXA

CY62157G30-45ZSXA


  • Manufacturer: Infineon Technologies
  • CONEVO NO: CY62157G30-45ZSXA
  • Package: 44-TSOP (0.400", 10.16mm Width)
  • Datasheet: PDF
  • Stock: In stock
  • Description: CY62157G30-45ZSXA(Kg)

Details

Tags

Parameters
Mfr Infineon Technologies
Series MoBL®
Package Tray
Product Status Active
Memory Type Volatile
Memory Format SRAM
Technology SRAM - Asynchronous
Memory Size 8Mbit
Memory Organization 512K x 16
Memory Interface Parallel
Write Cycle Time - Word, Page 45ns
Access Time 45 ns
Voltage - Supply 2.2V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 44-TSOP (0.400", 10.16mm Width)
Supplier Device Package 44-TSOP II
RoHS Status ROHS3 Compliant
ECCN 3A991B1B2
HTSUS 8542.32.0071
Standard Package 1,350
SRAM - Asynchronous Memory IC 8Mbit Parallel 45 ns 44-TSOP II
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