Infineon Technologies CY62157H30-55ZSXE

CY62157H30-55ZSXE


  • Manufacturer: Infineon Technologies
  • CONEVO NO: CY62157H30-55ZSXE
  • Package: 48-TFSOP (0.724", 18.40mm Width)
  • Datasheet: -
  • Stock: In stock
  • Description: CY62157H30-55ZSXE(Kg)

Details

Tags

Parameters
Mfr Infineon Technologies
Series MoBL®
Package Tray
Product Status Active
Memory Type Volatile
Memory Format SRAM
Technology SRAM - Asynchronous
Memory Size 8Mbit
Memory Organization 512K x 16
Memory Interface Parallel
Write Cycle Time - Word, Page 55ns
Access Time 55 ns
Voltage - Supply 2.2V ~ 3.6V
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 48-TFSOP (0.724", 18.40mm Width)
Supplier Device Package 48-TSOP I
RoHS Status ROHS3 Compliant
REACH Status REACH Unaffected
Standard Package 1,350
SRAM - Asynchronous Memory IC 8Mbit Parallel 55 ns 48-TSOP I
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