Infineon Technologies CYT3BB8CEBQ0AESGS

CYT3BB8CEBQ0AESGS


  • Manufacturer: Infineon Technologies
  • CONEVO NO: CYT3BB8CEBQ0AESGS
  • Package: 176-LQFP Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: CYT3BB8CEBQ0AESGS(Kg)

Details

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Parameters
Mfr Infineon Technologies
Series -
Package Tray
Product Status Active
Core Processor ARM® Cortex®-M0+/M7
Core Size 32-Bit Dual-Core
Speed 100MHz, 250MHz
Connectivity CANbus, Ethernet, I²C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT
Number of I/O 148
Program Memory Size 4.0625MB (4.0625M x 8)
Program Memory Type FLASH
EEPROM Size 256K x 8
RAM Size 768K x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V
Data Converters A/D 82x12b SAR
Oscillator Type External, Internal
Operating Temperature -40°C ~ 105°C (TA)
Mounting Type Surface Mount
Package / Case 176-LQFP Exposed Pad
Supplier Device Package 176-TEQFP (24x24)
Base Product Number CYT3BB8
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
Standard Package 40
ARM® Cortex®-M0+/M7 - Microcontroller IC 32-Bit Dual-Core 100MHz, 250MHz 4.0625MB (4.0625M x 8) FLASH 176-TEQFP (24x24)
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