Infineon Technologies CYT3BBBCEBQ0BZEGS

CYT3BBBCEBQ0BZEGS


  • Manufacturer: Infineon Technologies
  • CONEVO NO: CYT3BBBCEBQ0BZEGS
  • Package: 272-LFBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: CYT3BBBCEBQ0BZEGS(Kg)

Details

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Parameters
Mfr Infineon Technologies
Series -
Package Tray
Product Status Active
Core Processor ARM® Cortex®-M0+/M7
Core Size 32-Bit Dual-Core
Speed 100MHz, 250MHz
Connectivity CANbus, Ethernet, I²C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT
Number of I/O 220
Program Memory Size 4.0625MB (4.0625M x 8)
Program Memory Type FLASH
EEPROM Size 256K x 8
RAM Size 768K x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V
Data Converters A/D 90x12b SAR
Oscillator Type External, Internal
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 272-LFBGA
Supplier Device Package 272-BGA (16x16)
Base Product Number CYT3BBB
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
Standard Package 96
ARM® Cortex®-M0+/M7 - Microcontroller IC 32-Bit Dual-Core 100MHz, 250MHz 4.0625MB (4.0625M x 8) FLASH 272-BGA (16x16)
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