Infineon Technologies CYT3DLBBHBQ1BZSGS

CYT3DLBBHBQ1BZSGS


  • Manufacturer: Infineon Technologies
  • CONEVO NO: CYT3DLBBHBQ1BZSGS
  • Package: 272-BGA
  • Datasheet: -
  • Stock: In stock
  • Description: CYT3DLBBHBQ1BZSGS(Kg)

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Parameters
Mfr Infineon Technologies
Series Traveo™ T2G
Package Tray
Product Status Active
Core Processor ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size 32-Bit Dual-Core
Speed 240MHz
Connectivity CANbus, Ethernet, LINbus, SPI
Peripherals DMA, I²S, LVD, Temp Sensor, WDT
Number of I/O 135
Program Memory Size 4.063MB (4.063M x 8)
Program Memory Type FLASH
EEPROM Size 128K x 8
RAM Size 384K x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V
Data Converters -
Oscillator Type -
Operating Temperature -40°C ~ 105°C (TA)
Mounting Type Surface Mount
Package / Case 272-BGA
Supplier Device Package 272-BGA
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Standard Package 960
ARM® Cortex®-M0+, ARM® Cortex®-M7F Traveo™ T2G Microcontroller IC 32-Bit Dual-Core 240MHz 4.063MB (4.063M x 8) FLASH 272-BGA
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