Infineon Technologies SAK-XC2267-72F66LAC

SAK-XC2267-72F66LAC


  • Manufacturer: Infineon Technologies
  • CONEVO NO: SAK-XC2267-72F66LAC
  • Package: 100-LQFP Exposed Pad
  • Datasheet: -
  • Stock: In stock
  • Description: SAK-XC2267-72F66LAC(Kg)

Details

Tags

Parameters
Mfr Infineon Technologies
Series XC22xx
Package Bulk
Product Status Active
Core Processor C166SV2
Core Size 16/32-Bit
Speed 66MHz
Connectivity CANbus, EBI/EMI, I²C, LINbus, SPI, SSC, UART/USART, USI
Peripherals DMA, I²S, POR, PWM, WDT
Number of I/O 75
Program Memory Size 576KB (576K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 50K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V
Data Converters A/D 16x8/10b
Oscillator Type Internal
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 100-LQFP Exposed Pad
Supplier Device Package PG-LQFP-100-3
Base Product Number SAK-XC2267
RoHS Status Not applicable
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status Vendor Undefined
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 345
C166SV2 XC22xx Microcontroller IC 16/32-Bit 66MHz 576KB (576K x 8) FLASH PG-LQFP-100-3
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