Infineon Technologies TC364DP64F300FAAKXQMA1

TC364DP64F300FAAKXQMA1


  • Manufacturer: Infineon Technologies
  • CONEVO NO: TC364DP64F300FAAKXQMA1
  • Package: 144-LQFP Exposed Pad
  • Datasheet: -
  • Stock: In stock
  • Description: TC364DP64F300FAAKXQMA1(Kg)

Details

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Parameters
Mfr Infineon Technologies
Series AURIX™
Package Tray
Product Status Active
Core Processor TriCore™
Core Size 32-Bit Dual-Core
Speed 300MHz
Connectivity ASC, CANbus, Ethernet, FlexRay, HSSL, I²C, LINbus, MSC, PSI, QSPI, SENT
Peripherals DMA, I²S, LVDS, PWM, WDT
Program Memory Size 4MB (4M x 8)
Program Memory Type FLASH
EEPROM Size 128K x 8
RAM Size 672K x 8
Voltage - Supply (Vcc/Vdd) 2.97V ~ 5.5V
Data Converters A/D 70 SAR
Oscillator Type Internal
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 144-LQFP Exposed Pad
Supplier Device Package PG-TQFP-144-27
Base Product Number TC364DP64
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
Standard Package 540
TriCore™ AURIX™ Microcontroller IC 32-Bit Dual-Core 300MHz 4MB (4M x 8) FLASH PG-TQFP-144-27
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