Infineon Technologies XC2286M72F66LAAHXUMA1

XC2286M72F66LAAHXUMA1


  • Manufacturer: Infineon Technologies
  • CONEVO NO: XC2286M72F66LAAHXUMA1
  • Package: 144-LQFP Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: XC2286M72F66LAAHXUMA1(Kg)

Details

Tags

Parameters
Mfr Infineon Technologies
Series XC22xxM
Package Tape & Reel (TR)
Product Status Obsolete
Core Processor C166SV2
Core Size 16/32-Bit
Speed 66MHz
Connectivity CANbus, EBI/EMI, I²C, LINbus, SPI, SSC, UART/USART, USI
Peripherals I²S, POR, PWM, WDT
Number of I/O 118
Program Memory Size 576KB (576K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 50K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V
Data Converters A/D 24x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 144-LQFP Exposed Pad
Supplier Device Package PG-LQFP-144-4
Base Product Number XC2286
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN OBSOLETE
HTSUS 0000.00.0000
Other Names SP000361448
Standard Package 1,000
C166SV2 XC22xxM Microcontroller IC 16/32-Bit 66MHz 576KB (576K x 8) FLASH PG-LQFP-144-4
Contact Information
close