Infineon Technologies XC2387C136F100LABKXUMA1

XC2387C136F100LABKXUMA1


  • Manufacturer: Infineon Technologies
  • CONEVO NO: XC2387C136F100LABKXUMA1
  • Package: 144-LQFP Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: XC2387C136F100LABKXUMA1(Kg)

Details

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Parameters
Number of I/O 118
Program Memory Size 1.088MB (1.088M x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 90K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V
Data Converters A/D 24x10b
Oscillator Type External
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 144-LQFP Exposed Pad
Supplier Device Package PG-LQFP-144-4
Base Product Number XC2387
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Other Names SP000722460
Standard Package 500
Mfr Infineon Technologies
Series XC23xxC
Package Tape & Reel (TR)
Product Status Discontinued at Digi-Key
Core Processor C166SV2
Core Size 16/32-Bit
Speed 100MHz
Connectivity CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART
Peripherals I²S, POR, PWM, WDT
C166SV2 XC23xxC Microcontroller IC 16/32-Bit 100MHz 1.088MB (1.088M x 8) FLASH PG-LQFP-144-4
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