Intel 1SG165HU3F50I3VG

1SG165HU3F50I3VG


  • Manufacturer: Intel
  • CONEVO NO: 1SG165HU3F50I3VG
  • Package: 2397-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: 1SG165HU3F50I3VG(Kg)

Details

Tags

Parameters
Mfr Intel
Series Stratix® 10 GX
Package Tray
Product Status Active
Conevo-Key Programmable Not Verified
Number of LABs/CLBs 206250
Number of Logic Elements/Cells 1650000
Number of I/O 704
Voltage - Supply 0.77V ~ 0.97V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 2397-BBGA, FCBGA
Supplier Device Package 2397-FBGA, FC (50x50)
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
Other Names 544-1SG165HU3F50I3VG
Standard Package 1
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 704 1650000 2397-BBGA, FCBGA
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