Intel 1SG250HU3F50E3XG

1SG250HU3F50E3XG


  • Manufacturer: Intel
  • CONEVO NO: 1SG250HU3F50E3XG
  • Package: 2397-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: 1SG250HU3F50E3XG(Kg)

Details

Tags

Parameters
Mfr Intel
Series Stratix® 10 GX
Package Tray
Product Status Active
Conevo-Key Programmable Not Verified
Number of LABs/CLBs 312500
Number of Logic Elements/Cells 2500000
Number of I/O 704
Voltage - Supply 0.82V ~ 0.88V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 100°C (TJ)
Package / Case 2397-BBGA, FCBGA
Supplier Device Package 2397-FBGA, FC (50x50)
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
Other Names 544-1SG250HU3F50E3XG
Standard Package 1
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 704 2500000 2397-BBGA, FCBGA
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