Parameters | |
---|---|
Series | Cyclone® |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Package / Case | 144-LQFP |
Mfr | Intel |
Mounting Type | Surface Mount |
Operating Temperature | 0°C ~ 85°C (TJ) |
Supplier Device Package | 144-TQFP (20x20) |
Number of I/O | 104 |
Voltage - Supply | 1.425V ~ 1.575V |
Number of Logic Elements/Cells | 2910 |
Number of LABs/CLBs | 291 |
Total RAM Bits | 59904 |
Package | Tray |
Product Status | Obsolete |
Conevo-Key Programmable | Not Verified |
Other Names | 968962 |
Standard Package | 1 |
ECCN | OBSOLETE |
HTSUS | 0000.00.0000 |
The Intel EP1C3T144C8GA is a member of the Cyclone series of FPGAs (Field Programmable Gate Arrays) from Intel, designed for cost-sensitive applications. This pld device features 2910 logic elements and operates at a maximum frequency of 275.03 MHz. It is packaged in a 144-pin LQFP (Low-Profile Quad Flat Package), making it suitable for compact designs while providing a robust performance for various applications.
EP1C3T144C8GA Features
The EP1C3T144C8GA FPGA offers a range of features that enhance its versatility and usability. It includes up to 58.5 Kbits of embedded memory, 104 I/O pins, and supports multiple I/O standards such as LVTTL, LVCMOS, SSTL-2, and SSTL-3. The device can handle high-speed LVDS I/O at rates up to 640 Mbps, which is essential for applications requiring fast data transfer. Additionally, it supports various clock management options, including phase-locked loops (PLLs), to optimize performance in different operational scenarios.
EP1C3T144C8GA Applications
The EP1C3T144C8GA FPGA is widely used across various industries due to its flexibility and performance characteristics. It is commonly found in applications such as telecommunications, industrial automation, and consumer electronics, where programmable logic is essential for adapting to changing requirements. Its low power consumption and high integration capabilities make it an ideal choice for embedded systems, data processing, and control applications, allowing designers to implement complex functionalities in a compact form factor.