Microchip Technology DSPIC33EP64GP502-E/MM

DSPIC33EP64GP502-E/MM


  • Manufacturer: Microchip Technology
  • CONEVO NO: DSPIC33EP64GP502-E/MM
  • Package: 28-VQFN Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: DSPIC33EP64GP502-E/MM(Kg)

Details

Tags

Parameters
HTSUS 8542.31.0001
Standard Package 61
Mfr Microchip Technology
Series Automotive, AEC-Q100, dsPIC™ 33EP
Package Tube
Product Status Active
Core Processor dsPIC
Core Size 16-Bit
Speed 60 MIPs
Connectivity CANbus, I²C, IrDA, LINbus, SPI, UART/USART
Peripherals Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O 21
Program Memory Size 64KB (22K x 24)
Program Memory Type FLASH
EEPROM Size -
RAM Size 4K x 16
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V
Data Converters A/D 6x10b/12b
Oscillator Type Internal
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 28-VQFN Exposed Pad
Supplier Device Package 28-QFN-S (6x6)
Base Product Number DSPIC33EP64GP502
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN 3A991A2
dsPIC Automotive, AEC-Q100, dsPIC™ 33EP Microcontroller IC 16-Bit 60 MIPs 64KB (22K x 24) FLASH 28-QFN-S (6x6)
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