Micron Technology Inc. MT29F384G08EBHBBB0KB3WC1-R

MT29F384G08EBHBBB0KB3WC1-R


  • Manufacturer: Micron Technology Inc.
  • CONEVO NO: MT29F384G08EBHBBB0KB3WC1-R
  • Package: Die
  • Datasheet: -
  • Stock: In stock
  • Description: MT29F384G08EBHBBB0KB3WC1-R(Kg)

Details

Tags

Parameters
Mfr Micron Technology Inc.
Series -
Package Bulk
Product Status Active
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NAND
Memory Size 384Gbit
Memory Organization 48G x 8
Memory Interface Parallel
Write Cycle Time - Word, Page -
Voltage - Supply 2.5V ~ 3.6V
Operating Temperature 0°C ~ 70°C (TA)
Mounting Type Surface Mount
Package / Case Die
Supplier Device Package Die
Base Product Number MT29F384G08
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B1A
HTSUS 8542.32.0071
Standard Package 1
FLASH - NAND Memory IC 384Gbit Parallel Die
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