NXP USA Inc. DSP56F807VF80

DSP56F807VF80


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: DSP56F807VF80
  • Package: 160-BGA
  • Datasheet: PDF
  • Stock: In stock
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Mfr NXP USA Inc.
Series 56F8xx
Package Tray
Product Status Obsolete
Core Processor 56800
Core Size 16-Bit
Speed 80MHz
Connectivity CANbus, EBI/EMI, SCI, SPI
Peripherals POR, PWM, WDT
Number of I/O 32
Program Memory Size 120KB (60K x 16)
Program Memory Type FLASH
EEPROM Size -
RAM Size 4K x 16
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V
Data Converters A/D 16x12b
Oscillator Type External
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 160-BGA
Supplier Device Package 160-MAPBGA (15x15)
Base Product Number DSP56F807
RoHS Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Other Names 935323918557
Standard Package 630
56800 56F8xx Microcontroller IC 16-Bit 80MHz 120KB (60K x 16) FLASH 160-MAPBGA (15x15)
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