NXP USA Inc. LPC18S10FET180551

LPC18S10FET180551


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: LPC18S10FET180551
  • Package: 180-TFBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: LPC18S10FET180551(Kg)

Details

Tags

Parameters
Peripherals Brown-out Detect/Reset, DMA, I²S, POR, WDT
Number of I/O 49
Program Memory Size -
Program Memory Type ROMless
EEPROM Size -
RAM Size 136K x 8
Voltage - Supply (Vcc/Vdd) 2.2V ~ 3.6V
Data Converters A/D 4x10b; D/A 1x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 180-TFBGA
Supplier Device Package 180-TFBGA (12x12)
Base Product Number LPC18S10
ECCN 5A992C
HTSUS 8542.31.0001
Standard Package 1
Mfr NXP USA Inc.
Series LPC18xx
Package Bulk
Product Status Active
Core Processor ARM® Cortex®-M3
Core Size 32-Bit Single-Core
Speed 180MHz
Connectivity CANbus, EBI/EMI, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART
ARM® Cortex®-M3 LPC18xx Microcontroller IC 32-Bit Single-Core 180MHz ROMless 180-TFBGA (12x12)
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