NXP USA Inc. MC68HC705P6AMDW

MC68HC705P6AMDW


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MC68HC705P6AMDW
  • Package: 28-SOIC (0.295", 7.50mm Width)
  • Datasheet: PDF
  • Stock: In stock
  • Description: MC68HC705P6AMDW(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series HC05
Package Tube
Product Status Obsolete
Core Processor HC05
Core Size 8-Bit
Speed 2.1MHz
Connectivity SIO
Peripherals POR, WDT
Number of I/O 21
Program Memory Size 4.5KB (4.5K x 8)
Program Memory Type OTP
EEPROM Size -
RAM Size 176 x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V
Data Converters A/D 4x8b
Oscillator Type Internal
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 28-SOIC (0.295", 7.50mm Width)
Supplier Device Package 28-SOIC
Base Product Number MC68HC705
RoHS Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001
Standard Package 26
HC05 HC05 Microcontroller IC 8-Bit 2.1MHz 4.5KB (4.5K x 8) OTP 28-SOIC
Contact Information
close