NXP USA Inc. MC9S08RE16FDE

MC9S08RE16FDE


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MC9S08RE16FDE
  • Package: 48-VFQFN Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
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Mfr NXP USA Inc.
Series S08
Package Tray
Product Status Obsolete
Core Processor S08
Core Size 8-Bit
Speed 8MHz
Connectivity SCI
Peripherals LVD, POR, PWM, WDT
Number of I/O 39
Program Memory Size 16KB (16K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 1K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V
Data Converters -
Oscillator Type Internal
Operating Temperature 0°C ~ 70°C (TA)
Mounting Type Surface Mount
Package / Case 48-VFQFN Exposed Pad
Supplier Device Package 48-QFN-EP (7x7)
Base Product Number MC9S08
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001
Standard Package 260
S08 S08 Microcontroller IC 8-Bit 8MHz 16KB (16K x 8) FLASH 48-QFN-EP (7x7)
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