NXP USA Inc. MC9S12XEP100CVL

MC9S12XEP100CVL


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MC9S12XEP100CVL
  • Package: 208-BGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: MC9S12XEP100CVL(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series HCS12X
Package Tray
Product Status Active
Core Processor HCS12X
Core Size 16-Bit
Speed 50MHz
Connectivity CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals LVD, POR, PWM, WDT
Number of I/O 152
Program Memory Size 1MB (1M x 8)
Program Memory Type FLASH
EEPROM Size 4K x 8
RAM Size 64K x 8
Voltage - Supply (Vcc/Vdd) 1.72V ~ 5.5V
Data Converters A/D 32x12b
Oscillator Type External
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 208-BGA
Supplier Device Package 208-BGA (17x17)
Base Product Number MC9S12
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Other Names 935321428557
Standard Package 450
HCS12X HCS12X Microcontroller IC 16-Bit 50MHz 1MB (1M x 8) FLASH 208-BGA (17x17)
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