NXP USA Inc. MPC5553MZP132

MPC5553MZP132


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MPC5553MZP132
  • Package: 416-BBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: MPC5553MZP132(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series MPC55xx Qorivva
Package Tray
Product Status Active
Core Processor e200z6
Core Size 32-Bit Single-Core
Speed 132MHz
Connectivity CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals DMA, POR, PWM, WDT
Number of I/O 220
Program Memory Size 1.5MB (1.5M x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 64K x 8
Voltage - Supply (Vcc/Vdd) 1.35V ~ 1.65V
Data Converters A/D 40x12b
Oscillator Type External
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 416-BBGA
Supplier Device Package 416-PBGA (27x27)
Base Product Number MPC5553
RoHS Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Other Names 935324055557
Standard Package 200
e200z6 MPC55xx Qorivva Microcontroller IC 32-Bit Single-Core 132MHz 1.5MB (1.5M x 8) FLASH 416-PBGA (27x27)
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