NXP USA Inc. SPC5676RDK3MVU1

SPC5676RDK3MVU1


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: SPC5676RDK3MVU1
  • Package: 416-BBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: SPC5676RDK3MVU1(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series MPC56xx Qorivva
Package Tray
Product Status Active
Core Processor e200z7
Core Size 32-Bit Dual-Core
Speed 180MHz
Connectivity CANbus, EBI/EMI, SCI, SPI
Peripherals DMA, POR, PWM
Program Memory Size 6MB (6M x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 384K x 8
Voltage - Supply (Vcc/Vdd) 1.14V ~ 1.32V
Data Converters A/D 64x12b
Oscillator Type Internal
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 416-BBGA
Supplier Device Package 416-PBGA (27x27)
Base Product Number SPC5676
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Other Names 935314707557
Standard Package 200
e200z7 MPC56xx Qorivva Microcontroller IC 32-Bit Dual-Core 180MHz 6MB (6M x 8) FLASH 416-PBGA (27x27)
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