NXP USA Inc. SPC5744PK1AMMM9

SPC5744PK1AMMM9


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: SPC5744PK1AMMM9
  • Package: 257-LFBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: SPC5744PK1AMMM9(Kg)

Details

Tags

Parameters
HTSUS 8542.31.0001
Other Names 935326037557
Standard Package 760
Mfr NXP USA Inc.
Series MPC57xx
Package Tray
Product Status Active
Core Processor e200z4
Core Size 32-Bit Dual-Core
Speed 200MHz
Connectivity CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals DMA, LVD, POR, WDT
Program Memory Size 2.5MB (2.5M x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 384K x 8
Voltage - Supply (Vcc/Vdd) 3.15V ~ 5.5V
Data Converters A/D 64x12b
Oscillator Type Internal
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 257-LFBGA
Supplier Device Package 257-LFBGA (14x14)
Base Product Number SPC5744
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
e200z4 MPC57xx Microcontroller IC 32-Bit Dual-Core 200MHz 2.5MB (2.5M x 8) FLASH 257-LFBGA (14x14)
Contact Information
close