NXP USA Inc. UJA1169ATKZ

UJA1169ATKZ


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: UJA1169ATKZ
  • Package: 20-VFDFN Exposed Pad
  • Datasheet: -
  • Stock: In stock
  • Description: UJA1169ATKZ(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series -
Package Tape & Reel (TR)
Product Status Active
Applications System Basis Chip
Interface CAN, SPI
Voltage - Supply 3V ~ 28V
Package / Case 20-VFDFN Exposed Pad
Supplier Device Package 20-HVSON (3.5x5.5)
Mounting Type Surface Mount
Base Product Number UJA1169
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001
Standard Package 3,000
System Basis Chip Interface 20-HVSON (3.5x5.5)
Contact Information
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