Renesas Electronics America Inc DF2319VF25V

DF2319VF25V


  • Manufacturer: Renesas Electronics America Inc
  • CONEVO NO: DF2319VF25V
  • Package: 100-BQFP
  • Datasheet: PDF
  • Stock: In stock
  • Description: DF2319VF25V(Kg)

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Parameters
Mfr Renesas Electronics America Inc
Series H8® H8S/2300
Package Tray
Product Status Obsolete
Core Processor H8S/2000
Core Size 16-Bit
Speed 25MHz
Connectivity SCI, SmartCard
Peripherals POR, PWM, WDT
Number of I/O 70
Program Memory Size 512KB (512K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 8K x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 3.6V
Data Converters A/D 8x10b; D/A 2x8b
Oscillator Type Internal
Operating Temperature -20°C ~ 75°C (TA)
Mounting Type Surface Mount
Package / Case 100-BQFP
Supplier Device Package 100-QFP (14x20)
Base Product Number DF2319
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001
Other Names HD64F2319VF25V
Standard Package 1
H8S/2000 H8® H8S/2300 Microcontroller IC 16-Bit 25MHz 512KB (512K x 8) FLASH 100-QFP (14x20)
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