Renesas Electronics America Inc R7F7016534ABG-C#HC1

R7F7016534ABG-C#HC1


  • Manufacturer: Renesas Electronics America Inc
  • CONEVO NO: R7F7016534ABG-C#HC1
  • Package: 272-FBGA
  • Datasheet: -
  • Stock: In stock
  • Description: R7F7016534ABG-C#HC1(Kg)

Details

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Parameters
Mfr Renesas Electronics America Inc
Series RH850/F1x
Package Tape & Reel (TR)
Product Status Active
Core Processor RH850G3KH
Core Size 32-Bit
Speed 240MHz
Peripherals DMA, LVD, PWM, WDT
Number of I/O 214
Program Memory Size 4MB (4M x 8)
Program Memory Type FLASH
EEPROM Size 128K x 8
RAM Size 512K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V
Data Converters A/D 38x10b, 32x12b
Oscillator Type Internal
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 272-FBGA
Supplier Device Package 272-FBGA (17x17)
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Other Names 559-R7F7016534ABG-C#HC1TR
Standard Package 1
RH850G3KH RH850/F1x Microcontroller IC 32-Bit 240MHz 4MB (4M x 8) FLASH 272-FBGA (17x17)
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