Silicon Motion, Inc. SM662PBC-BDSS

SM662PBC-BDSS


  • Manufacturer: Silicon Motion, Inc.
  • CONEVO NO: SM662PBC-BDSS
  • Package: 153-TFBGA
  • Datasheet: -
  • Stock: In stock
  • Description: SM662PBC-BDSS(Kg)

Details

Tags

Parameters
Technology FLASH - NAND (SLC), FLASH - NAND (TLC)
Memory Size 160Gbit
Memory Organization 20G x 8
Memory Interface eMMC
Write Cycle Time - Word, Page -
Voltage - Supply -
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Package / Case 153-TFBGA
Supplier Device Package 153-BGA (11.5x13)
Base Product Number SM662
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN 3A991B1A
HTSUS 8542.32.0071
Other Names 1984-SM662PBC-BDSS
Standard Package 1
Mfr Silicon Motion, Inc.
Series Ferri-eMMC®
Package Tray
Product Status Obsolete
Memory Type Non-Volatile
Memory Format FLASH
FLASH - NAND (SLC), FLASH - NAND (TLC) Memory IC 160Gbit eMMC 153-BGA (11.5x13)
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