Toshiba Semiconductor and Storage TMPM365FYXBG(HJ)

TMPM365FYXBG(HJ)


  • Manufacturer: Toshiba Semiconductor and Storage
  • CONEVO NO: TMPM365FYXBG(HJ)
  • Package: 105-LFBGA
  • Datasheet: PDF
  • Stock: In stock
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Parameters
Mfr Toshiba Semiconductor and Storage
Series TX03
Package Tray
Product Status Active
Core Processor ARM® Cortex®-M3
Core Size 32-Bit Single-Core
Speed 48MHz
Connectivity I²C, SIO, SPI, UART/USART, USB
Peripherals DMA, WDT
Number of I/O 73
Program Memory Size 256KB (256K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 24K x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 3.6V
Data Converters A/D 12x12b
Oscillator Type External
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 105-LFBGA
Supplier Device Package 105-LFBGA (9x9)
Base Product Number TMPM365
RoHS Status RoHS Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 168
ARM® Cortex®-M3 TX03 Microcontroller IC 32-Bit Single-Core 48MHz 256KB (256K x 8) FLASH 105-LFBGA (9x9)
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