Trenz Electronic GmbH TE0729-02-62I63FAK

TE0729-02-62I63FAK


  • Manufacturer: Trenz Electronic GmbH
  • CONEVO NO: TE0729-02-62I63FAK
  • Package:
  • Datasheet: PDF
  • Stock: In stock
  • Description: TE0729-02-62I63FAK(Kg)

Details

Tags

Parameters
Mfr Trenz Electronic GmbH
Series -
Package Bulk
Product Status Discontinued at Digi-Key
Module/Board Type MCU, FPGA
Core Processor ARM Cortex-A9
Co-Processor Zynq-7000 (Z-7020)
Speed -
Flash Size 32MB
RAM Size 512MB
Connector Type B2B
Size / Dimension 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature -40°C ~ 85°C
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN 3A991D
HTSUS 8471.50.0150
Other Names 1686-TE0729-02-62I63FAK
Standard Package 1
- Embedded Module ARM Cortex-A9 Zynq-7000 (Z-7020) 512MB 32MB
Contact Information
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