Winbond Electronics W988D6FBGX6I

W988D6FBGX6I


  • Manufacturer: Winbond Electronics
  • CONEVO NO: W988D6FBGX6I
  • Package: 54-TFBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: W988D6FBGX6I(Kg)

Details

Tags

Parameters
Mfr Winbond Electronics
Series -
Package Tray
Product Status Obsolete
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - Mobile LPSDR
Memory Size 256Mbit
Memory Organization 16M x 16
Memory Interface Parallel
Clock Frequency 166 MHz
Write Cycle Time - Word, Page 15ns
Access Time 5.4 ns
Voltage - Supply 1.7V ~ 1.95V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 54-TFBGA
Supplier Device Package 54-VFBGA (8x9)
Base Product Number W988D6
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.32.0002
Standard Package 312
SDRAM - Mobile LPSDR Memory IC 256Mbit Parallel 166 MHz 5.4 ns 54-VFBGA (8x9)
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